LORD Thermoset SC-320是一种双组份体系，设计意图是满足电气/电子封装领域对高导热性的要求，同时又保持有机硅的理想特性。
LORD Thermoset SC-320 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
Features and Benefits
Low Stress – exhibits low shrinkage and stress on components as it cures.
Durable – composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.
Low Viscosity – maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials.
Environmentally Resistant – provides excellent thermal shock resistance.
UL Rated – provides excellent flame retardancy; UL 94 V-0 certified.
Mixing – Thoroughly stir each component prior to mixing together. Mix Thermoset SC-320 resin with Thermoset SC-320 hardener at a 1:1 ratio, by weight or volume. Automatic meter/mix/dispense equipment may be used for high volume production.
Unless a closed-chamber mechanical mixer is used, air will be introduced into the encapsulant system either during mixing or when catalyzing the mixture. Electrical properties of the silicone encapsulant are best when air bubbles and voids are minimized. Therefore, in extremely high voltage or other critical applications, vacuuming may be appropriate.
Applying – Apply silicone encapsulant using handheld cartridges or automatic meter/mix/dispense equipment.
Avoid applying Thermoset SC-320 encapsulant to surfaces that contain cure inhibiting ingredients, such as amines, sulfur or tin salts. If bonding surface is in question, apply a test patch of Thermoset SC-320 encapsulant to the surface and allow it to set for the normal cure time.
|SC-320 Resin||SC-320 Hardener||Mixed|
|Appearance||Pink Liquid||White Liquid||Light Pink Liquid|
|Viscosity, cps @ 25°C||25,000||20,000||-|
|Gel Time, min @ 121°C||-||-||2-5|
|Working Life, min @ 25°C||-||-||40|
Typical Cured Properties**
**Cure schedule of 60 minutes at 125°C. Data is typical and not to be used for specification purposes.
Curing – Allow encapsulant to cure for 24 hours at room temperature (25°C) or for 60 minutes at 125°C. This time-at-temperature profile refers to the time the bondline should be allowed to cure once it reaches the target temperature. Allowance should be made for oven ramp rates, parts with large thermal mass and other circumstances that may delay bondline actually reaching the target temperature.
Shelf life of each component is nine months from date of manufacture when stored at 25°C in original, unopened container.
Thermoset SC-320 encapsulant evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.
Before using this or any LORD product, refer to the Material Safety Data Sheet (MSDS) and label for safe use and handling instructions.
For industrial/commercial use only. Must be applied by trained personnel only. Not to be used in household applications. Not for consumer use.